¡E Layout design flexibility
¡E Multiple cavities
¡E Total height between 0.2mm to 20mm
¡E 100% seal, no solder leakage concerns
¡E Avoid solder temperature exposure
¡E Easy to install and rework
¡E Extremely Cost effective
¡E Smaller footprint for space-constrained designs
¡E Light weight

- Heat press
- Conductive adhesives

- Significant size and weight reduction
- Superior shielding effectiveness due to our
   unique Cu/NiCr metallization process
- Small footprint provides over 50% savings of
   PCB space over traditional methods
- Simplified manufacturing process
- Single PFcan can provide multiple cavities for
  reduced inventory and tooling cost
- Shorter time to market