Thermal Interface Material - Thermal Pad series

GP2000 is a ceramic particles filled silicone rubber, which is good balance for thermal performance with competitive price and providing 1.2W thermal conductivity.
GP3000 is using the silicone rubber with acting advanced thermal conductivity, it is a ceramic particles filled silicone rubber, which is a highly conformal and thermally conductive thermal pad.
GP5000 is using the silicone rubber with very good thermal conductivity, it is a enhanced ceramic particles filled silicone rubber, which is a highly conformal and thermally conductive thermal pad.
GP7000 is using the silicone rubber with excellent thermal conductivity, it is a high performance ceramic particles filled silicone rubber, which is a highly conformal and thermally conductive thermal pad.
GP8000 is using the silicone rubber with excellent thermal conductivity, it is a special treated high performance ceramic particles filled silicone rubber, which is a highly conformal and thermally conductive thermal pad.

DataSheet

Typical Physical Properties			Test method	GP2000	GP3000	GP5000	GP7000	GP8000
Construction	Thickness ( mm )			0.13~3.0	0.13~5.0	0.13~5.0	0.13~5.0	0.13~5.0
	Color			Blue	Gray	Light Blue	Light Gray	Light Gray
	Binder			Ceramic	Ceramic	Ceramic	Ceramic	Ceramic
	Carrier			Silicone	Silicone	Silicone	Silicone	Silicone
Thermal	Continuous Use Temp ( ℃ )		TGA+DMA	-40~200
	Thermal Conductivity ( W/m-K )		ASTM 5740/ E 1530	1.2	2.0	3.0	5.0	7.8
ElEC	Volume Resistivity ( Ω-cm )		ASTM D 257
	Dielectric Constant (ε)	1M Hz		5.85	6.1	NA	NA	NA
Mechanical	Hardness ( Shore OO )		ASTM D 2240	35	35	35	50	55
	Specific Gravity		ASTM D 729	2.6	2.8	3.26	2.7	2.55
	Tensile Strength ( Kg/c㎡ )		ASTM D638/ D 412	65	66	46	35	42
	Elongation ( % )		ASTM D 412	56	56	54	48	25
	Noncombustibility			UL-94

To download page
Download Thermal Pad Datasheet Download GP2000 Datasheet
Download GP3000 Datasheet Download GP5000 Datasheet
Download GP7000 Datasheet Download GP8000 Datasheet

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Thermal Interface material - Insulation Pad

TennVac's Thermal pad IP1000 is a fiberglass-reinforced material, filled with functional ceramic particles silicone rubber, which is a high performance interface pad and providing 3.8W thermal conductivity. It is used when the lowest thermal resistance and highest Dielectric strength are required. Thermal pad IP1000 series is a fiberglass-reinforced material.

Benefit

- Continuous roll package rubber
- Excellent Thermal conductivity
- Ultra soft, highly compressible
- Good wetting
- Self tacky or additional PSA if required

Typical Applications

- Power Conversion Equipment
- Power Semiconductors:
- MOSFETs& IGBTs packages
- Audio and Video Components
- Automotive Control Units
- Motor Controllers
- General High Pressure Interfaces

To download page
Download Insulation Pad Datasheet

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Thermal Interface material - Putty Pad

Putty-Pad PP5000 Series is the best material for applications where large tolerance differences create the need for compression of interface material beyond 50% of its original thickness. Putty-Pad PP5000 flows to ensure low pressures on the components being cooled. In conjunction with outstanding compression characteristics, Putty Pad PP5000 has a high thermal conductivity that results in very low thermal resistance. Putty-Pad PP5000 is naturally tacky and requires no further adhesive coating, which would inhibit thermal performance. Putty-Pad PP5000 has a hardness of 8 (Shore OO), is electrically insulating, and is stable from -45°C to 200°C.

Benefit

- Soft and ultra high compressibility for low stress applications
- 3.2 W/mK thermal conductivity
- Available in sheets form from 0.5 to 6.0mm thickness
- Naturally sticky, no additional adhesion coating

Typical Applications

- Cooling multiple components to the chassis or frame
- Entire large panel printed circuit board cooling
- Semiconductor automated test equipment
- Any high compression low stress applications

To download page
Download Putty Pad Datasheet

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Thermal Interface material - Thermally Conductive Grease

Max-Grease is high thermally conductive grease, it is a silicone based and filled with high performance
blended thermally conductive metal oxide. It is an idea solution for CPU and high rating integrated
circuits, the particles fill the small gap in the structure and provide a better junction for thermal
conductivity which can enhance the thermal module performance.

Benefit

- High thermal conductivity.
- Low bleeding, good wetting, could apply for screen printing.
- High electrical insulation.
- Wide operation temperature range.
- High chemical stability and reliability.

Typical Applications

- Semi-conductors and heat sink
- Power module
- CPU and GPU

To download page
DownloadThermal Grease Datasheet

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