|
|
|
|
|
|
|
|
|
|
Thermal Interface Material
|
| |
|
| |
|
|
| |
///
Thermal Interface Material
|
|
| |
|
|
Thermal Interface Material -
Gap Pad series
GP2000 is a ceramic particles filled
silicone rubber, which is good balance for thermal performance
with competitive price and providing 1.2W thermal conductivity.
GP3000 is using the silicone rubber with acting advanced
thermal conductivity, it is a ceramic particles filled
silicone rubber, which is a highly conformal and thermally
conductive gap filler pad.
GP5000 is using the silicone rubber with very good thermal
conductivity, it is a enhanced ceramic particles filled
silicone rubber, which is a highly conformal and thermally
conductive gap filler pad.
GP7000 is using the silicone rubber with excellent thermal
conductivity, it is a high performance ceramic particles
filled silicone rubber, which is a highly conformal
and thermally conductive gap filler pad.
GP8000 is using the silicone rubber with excellent thermal
conductivity, it is a special treated high performance
ceramic particles filled silicone rubber, which is a
highly conformal and thermally conductive gap filler
pad.
DataSheet
|
Typical Physical Properties
|
Test method
|
GP2000
|
GP3000
|
GP5000
|
GP7000
|
GP8000
|
|
Construction
|
Thickness
( mm )
|
|
0.13~3.0
|
0.13~5.0
|
0.13~5.0
|
0.13~5.0
|
0.13~5.0
|
|
Color
|
|
Blue
|
Gray
|
Light Blue
|
Light Gray
|
Light Gray
|
|
Binder
|
|
Ceramic
|
Ceramic
|
Ceramic
|
Ceramic
|
Ceramic
|
|
Carrier
|
|
Silicone
|
Silicone
|
Silicone
|
Silicone
|
Silicone
|
|
Thermal
|
Continuous
Use Temp
( ¢J )
|
TGA+DMA
|
-40~200
|
|
Thermal
Conductivity
( W/m-K )
|
ASTM 5740/ E 1530
|
1.2
|
2.0
|
3.0
|
5.0
|
7.8
|
|
ElEC
|
Volume
Resistivity
( £[-cm )
|
ASTM D 257
|
|
|
|
|
|
|
Dielectric
Constant
(£`)
|
1M Hz
|
|
5.85
|
6.1
|
NA
|
NA
|
NA
|
|
Mechanical
|
Hardness
( Shore OO )
|
ASTM D 2240
|
35
|
35
|
35
|
50
|
55
|
|
Specific Gravity
|
ASTM D 729
|
2.6
|
2.8
|
3.26
|
2.7
|
2.55
|
|
Tensile Strength
( Kg/c¢T )
|
ASTM D638/ D 412
|
65
|
66
|
46
|
35
|
42
|
|
Elongation
( % )
|
ASTM D 412
|
56
|
56
|
54
|
48
|
25
|
|
Noncombustibility
|
|
UL-94
|
To
download page
Download
Gap Pad Datasheet
Download
GP2000 Datasheet
Download
GP3000 Datasheet
Download
GP5000 Datasheet
Download
GP7000 Datasheet
Download
GP8000 Datasheet
|
Thermal Interface material - Insulation Pad
TennVac's Thermal pad IP1000 is a fiberglass-reinforced
material, filled with functional ceramic particles silicone
rubber, which is a high performance interface pad and
providing 3.8W thermal conductivity. It is used when
the lowest thermal resistance and highest Dielectric
strength are required. Thermal pad IP1000 series is
a fiberglass-reinforced material.
Benefit
- Continuous roll package rubber
- Excellent Thermal conductivity
- Ultra soft, highly compressible
- Good wetting
- Self tacky or additional PSA if required
Typical Applications
- Power Conversion Equipment
- Power Semiconductors:
- MOSFETs& IGBTs packages
- Audio and Video Components
- Automotive Control Units
- Motor Controllers
- General High Pressure Interfaces
To
download page
Download
Insulation Pad Datasheet
TOP
|
Thermal Interface material - Putty Pad
Putty-Pad PP5000 Series is the best
material for applications where large tolerance differences
create the need for compression of interface material
beyond 50% of its original thickness. Putty-Pad PP5000
flows to ensure low pressures on the components being
cooled. In conjunction with outstanding compression
characteristics, Putty Pad PP5000 has a high thermal
conductivity that results in very low thermal resistance.
Putty-Pad PP5000 is naturally tacky and requires no
further adhesive coating, which would inhibit thermal
performance. Putty-Pad PP5000 has a hardness of 8 (Shore
OO), is electrically insulating, and is stable from
-45¢XC to 200¢XC.
Benefit
- Soft and ultra high compressibility
for low stress applications
- 3.2 W/mK thermal conductivity
- Available in sheets form from 0.5 to 6.0mm thickness
- Naturally sticky, no additional adhesion coating
Typical Applications
- Cooling multiple components to the
chassis or frame
- Entire large panel printed circuit board cooling
- Semiconductor automated test equipment
- Any high compression low stress applications
To
download page
Download
Putty Pad Datasheet
TOP
|
Thermal Interface material - Thermally Conductive Grease
Max-Grease is high thermally conductive
grease, it is a silicone based and filled with high
performance
blended thermally conductive metal oxide. It is an idea
solution for CPU and high rating integrated
circuits, the particles fill the small gap in the structure
and provide a better junction for thermal
conductivity which can enhance the thermal module performance.
Benefit
- High thermal conductivity.
- Low bleeding, good wetting, could apply for screen
printing.
- High electrical insulation.
- Wide operation temperature range.
- High chemical stability and reliability.
Typical Applications
- Semi-conductors and heat sink
- Power module
- CPU and GPU
To
download page
DownloadThermal
GreaseDatasheet
TOP
|
|
|
|
|
| |
|
|
| |
|
|
|
